Processing Speed:4 GHz
Memory Size:16 GB DDR4
Operating Temperature:-20°C to 60°C
Communication Interface:Modbus, EtherCAT, CANopen
Power Consumption:250W
Dimensions:140mm x 100mm x 70mm
Weight:1.2kg
Engineered for seamless integration into complex industrial control systems, the HP ECPU500 K HCD90 H Power Module delivers robust computing power and exceptional efficiency.
With its advanced architecture, this module supports multiple communication protocols, ensuring compatibility and ease of setup in diverse industrial settings.
Featuring an aluminum alloy enclosure, the HP ECPU500 K HCD90 H is designed to withstand harsh environmental conditions, providing unparalleled durability and reliability.
Equipped with a state-of-the-art processor and ample memory, it ensures smooth operation even under heavy load conditions, making it ideal for applications requiring high computational demands.
This power module comes with a comprehensive set of I/O interfaces, facilitating seamless connection with various sensors, actuators, and other components in your automation system.
Backed by HP’s commitment to quality and support, the HP ECPU500 K HCD90 H Power Module offers a cost-effective solution for enhancing the performance and reliability of your industrial automation projects.
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