Dimension (LxWxH):11 x 6 x 6.7 cm
Weight:0.14 kg
Type:Communication Module
Board Material:High-grade circuit board material
Integrated Circuits:Over forty ICs for enhanced functionality
Heat Sink Quantity:Three for optimal thermal management
Relay Count:Eight, grouped in fours for efficiency
Resistors:Various types including wire-wound, for precise electrical resistance
Capacitors:For stable power supply and signal processing
Diodes:Critical for signal direction and protection
Reference Designators:Easy identification of components
Board Number:Unique identifying number for traceability
Compatibility:Designed for seamless integration with GE’s Speedtronic Mark VI system
The GE IS200AEPAH1AEC is meticulously engineered to integrate seamlessly into advanced industrial control systems, providing unparalleled performance under demanding conditions.
This PCB component features a robust design, incorporating a variety of essential electronic components including relays, heat sinks, wire-wound resistors, capacitors, diodes, and over forty integrated circuits for enhanced functionality and reliability.
Each component is marked with a unique reference designator, ensuring ease of identification and facilitating quick maintenance and troubleshooting.
Manufactured with high-grade copper and epoxy resin, the board is not only durable but also exhibits excellent thermal conductivity, enhancing its operational lifespan in various industrial environments.
The IS200AEPAH1AEC is equipped with precise factory-drilled holes for enhanced thermal management, further contributing to its overall stability and performance in critical applications.
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